Reducing the high heat flux central processing unit temperature under a lower pressure drop has become essential to data center cooling. Based on a chip with a heat flux density of 80 W/cm2, this study uses COMSOL Multiphysics simulation software to study the cooling effects of different structures of fin-type water-cooled radiators. This study analyzed the change in chip temperature, pressure loss in the radiator, and comprehensive heat transfer coefficient of the radiator under different flow rates by changing the area of the bottom plate, the position of the water inlet and outlet, and the gap length of the finless area. The results show that the heat dissipation effect is best when the heat sink area is close to the chip area. Additionally, it was determined that a moderate gap length has a certain optimization effect on the finned heat sink. Finally, the optimized structure for a finned, water-cooled radiator is proposed.
Keywords fin type, water cooling, heat sink, CPU cooling, high heat flux