This paper reports on the construction of a two stage loop thermosyphon cooling system and the analysis of its heat transfer mechanisms. The temperature and heat resistance distributions under various liquid filling ratios and heat loads are summarized. Further, the heat transfer boundary of the system and conditions for the two operating limits (dry out and immersion) were determined. Finally, the heat transfer paths obtained under standard and immersion limit operating conditions and the characteristics of coolants were analyzed and compared.
Keywords Chip cooling, loop thermosyphon, liquid cooling