Volume 58

Integrated topology optimization and microchannel cold plate for chip cooling Ningbo Wang, Bo Tian, Lu Liu, Junshan Li, Shuangquan Shao

Abstract

To address the challenge of high heat flux chip cooling, this study proposes a novel liquid-cooled heat sink that integrates topology optimization with microchannel design. The novel proposal combines the superior flow characteristics of straight microchannels with the enhanced heat dissipation performance of topologically optimized structures. Firstly, a multi-objective topology optimization framework is developed to simultaneously minimize the average temperature and power dissipation of the cold plate, achieving a balance between thermal and hydraulic performance. Secondly, a three-dimensional numerical model is constructed based on the results of two-dimensional topology optimization, and its accuracy is validated. Finally, the performance of the proposed scheme was compared with that of the straight microchannel and separate topology optimization design. The results show that the proposed structure reduces the maximum chip temperature by 4.28 K and the pressure drop by 319.42 Pa compared with the straight microchannel, while also improving temperature uniformity. These findings demonstrate the effectiveness of the integrated scheme for designing high-performance cold plates tailored to the thermal management needs of electronic devices.

Keywords Liquid cooled heat sink, High heat flux chip cooling, Topology optimization, Heat exchange